An electronic device includes: a wiring substrate;a plurality of components having different heights mounted on one surface of the wiring substrate; and a flexible substrate, the flexible substrate being formed by laminating on a one surface side of the wiring substrate, that covers the plurality of components, the flexible substrate including a first portion that covers, among the plurality of components, one or more first components that have heights that are equivalent to or lower than a first height, and a second portion that covers, among the plurality of components, one or more second components other than the one or more first components, a first rigidity of the first portion being higher than a second rigidity of the second portion.