A manufacturing method of a multilayer substrate uses a multilayer insulation film which includes a first insulation layer and a second insulation layer laminated on one surface of the first insulation layer, the second insulation layer being configured such that, in partially removing the second insulation layer, only the second insulation layer is enabled to be selectively removed to form a groove having a depth equal to a thickness of the second insulation layer on an obtained insulation layer. The manufacturing method includes: laminating the multilayer insulation film on a surface of a circuit board; selectively and partially removing only the second insulation layer out of the first insulation layer and the second insulation layer to form the groove having a depth equal to the thickness of the second insulation layer on the obtained insulation layer; and forming metal wiring within the groove formed on the insulation layer.