Invention Grant
- Patent Title: Endograft delivery device assembly
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Application No.: US15203095Application Date: 2016-07-06
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Publication No.: US09889030B2Publication Date: 2018-02-13
- Inventor: James Collins
- Applicant: Cook Medical Technologies LLC
- Applicant Address: US IN Bloomington
- Assignee: Cook Medical Technologies LLC
- Current Assignee: Cook Medical Technologies LLC
- Current Assignee Address: US IN Bloomington
- Agent Richard J. Godlewski
- Priority: AU2015215913 20150820
- Main IPC: A61F2/966
- IPC: A61F2/966 ; A61F2/07

Abstract:
An endograft delivery device assembly is disclosed. The assembly comprises: a tip; a guide wire cannula, the guide wire cannula; a pusher disposed around the guide wire cannula, the pusher having a sheath assembly receiving portion at a proximal end thereof and a main portion extending distally from the sheath assembly receiving portion to a distal end, the sheath assembly receiving portion having at least one longitudinally extending groove; and a sheath assembly slidably mounted to the sheath assembly receiving portion of the pusher. The sheath assembly has a sheath portion, mountable over a endograft, and slide connecter portion. The slide connector portion has at least one inwardly projecting key, the key keying with the groove. The sheath assembly is slidably movable from an extended position over the endograft to a retracted position in which the endograft is uncovered.
Public/Granted literature
- US20170049595A1 ENDOGRAFT DELIVERY DEVICE ASSEMBLY Public/Granted day:2017-02-23
Information query
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