Invention Grant
- Patent Title: Liquid ejecting head, ejecting element substrate and liquid ejecting apparatus
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Application No.: US15155590Application Date: 2016-05-16
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Publication No.: US09889650B2Publication Date: 2018-02-13
- Inventor: Takuma Kodoi , Keiji Tomizawa
- Applicant: CANON KABUSHIKI KAISHA
- Applicant Address: JP Tokyo
- Assignee: Canon Kabushiki Kaisha
- Current Assignee: Canon Kabushiki Kaisha
- Current Assignee Address: JP Tokyo
- Agency: Fitzpatrick, Cella, Harper & Scinto
- Priority: JP2015-104876 20150522
- Main IPC: B41J2/145
- IPC: B41J2/145 ; B41J2/14

Abstract:
There are provided a liquid ejecting head, an ejecting element substrate and a liquid ejecting apparatus that can suppress degradation in print quality. Therefore in an ejecting element substrate arranged the closest to the center of a support member, a flow resistance of a flow passage corresponding to an ejection opening of an ejection opening array arranged the closest to the center of the ejecting element substrate is made high.
Public/Granted literature
- US20160339700A1 LIQUID EJECTING HEAD, EJECTING ELEMENT SUBSTRATE AND LIQUID EJCTING APPARATUS Public/Granted day:2016-11-24
Information query
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