Invention Grant
- Patent Title: Fluidic dispensing device
-
Application No.: US15373684Application Date: 2016-12-09
-
Publication No.: US09889670B1Publication Date: 2018-02-13
- Inventor: Steven R. Komplin , James D. Anderson, Jr.
- Applicant: FUNAI ELECTRIC CO., LTD.
- Applicant Address: JP
- Assignee: FUNAI ELECTRIC CO., LTD.
- Current Assignee: FUNAI ELECTRIC CO., LTD.
- Current Assignee Address: JP
- Agency: Aust IP Law
- Main IPC: B41J2/175
- IPC: B41J2/175

Abstract:
A fluidic dispensing device has a body that includes a base wall having an exterior base surface, and an interior perimetrical wall that extends from the base wall to define a chamber. The interior perimetrical wall has a perimetrical end surface. The body has an exterior wall extending away from the base wall. The exterior wall has a chip mounting surface defining a first plane, the base wall being oriented along a second plane, the first plane being orthogonal to the second plane. An ejection chip is mounted to the chip mounting surface of the body. A diaphragm is engaged with the perimetrical end surface of the chamber to define a fluid reservoir. A lid is attached to the body, with the diaphragm interposed between the lid and the body. The body and the lid define a split at a juncture of the lid and the body.
Information query
IPC分类: