Invention Grant
- Patent Title: Phosphonium compound, epoxy resin composition including the same and semiconductor device prepared using the same
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Application No.: US15209871Application Date: 2016-07-14
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Publication No.: US09890307B2Publication Date: 2018-02-13
- Inventor: Ki Hyeok Kwon , Min Gyum Kim , Joo Young Chung , Jin Min Cheon , Jin Woo Choi , Seung Han , Dong Hwan Lee
- Applicant: SAMSUNG SDI CO., LTD.
- Applicant Address: KR Yongin-Si, Gyeonggi-Do
- Assignee: SAMSUNG SDI CO., LTD.
- Current Assignee: SAMSUNG SDI CO., LTD.
- Current Assignee Address: KR Yongin-Si, Gyeonggi-Do
- Agency: Lee & Morse, P.C.
- Priority: KR10-2015-0100672 20150715
- Main IPC: C08L63/00
- IPC: C08L63/00 ; C08G59/70 ; B01J27/182 ; H01L23/29 ; C09J163/00 ; C07F7/04 ; C07F9/54
Abstract:
A phosphonium compound, an epoxy resin composition including the same, a semiconductor device encapsulated with the same, and a method of encapsulating a semiconductor device, the phosphonium compound being represented by Formula 1:
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