Invention Grant
- Patent Title: Pre-heat ring designs to increase deposition uniformity and substrate throughput
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Application No.: US13250906Application Date: 2011-09-30
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Publication No.: US09890455B2Publication Date: 2018-02-13
- Inventor: Nyi O. Myo , John S. Webb , Masato Ishii , Xuebin Li , Zhiyuan Ye , Ali Zojaji
- Applicant: Nyi O. Myo , John S. Webb , Masato Ishii , Xuebin Li , Zhiyuan Ye , Ali Zojaji
- Applicant Address: US CA Santa Clara
- Assignee: APPLIED MATERIALS, INC.
- Current Assignee: APPLIED MATERIALS, INC.
- Current Assignee Address: US CA Santa Clara
- Agency: Patterson + Sheridan LLP
- Main IPC: C23C16/455
- IPC: C23C16/455 ; C23C16/458 ; H01L21/687 ; H01L21/673

Abstract:
Embodiments of the present invention generally relates to apparatus for use in film depositions. The apparatus generally include pre-heat rings adapted to be positioned in a processing chamber. In one embodiment, a pre-heat ring includes a ring having an inner edge and an outer edge. The outer edge has a constant radius. The inner edge is oblong-shaped and may have a first portion having a constant radius measured from a center of a circle defined by an outer circumference of the ring. A second portion may have a constant radius measured from a location other than the center of the outer circumference. In another embodiment, a processing chamber includes a pre-heat ring positioned around the periphery of a substrate support. The pre-heat ring includes an inner edge having a first portion, a second portion, and one or more linear portions positioned between the first portion and the second portion.
Public/Granted literature
- US20120103263A1 PRE-HEAT RING DESIGNS TO INCREASE DEPOSITION UNIFORMITY AND SUBSTRATE THROUGHPUT Public/Granted day:2012-05-03
Information query
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