- Patent Title: Electrolysis copper-alloy foil, method of the same, electrolytic-solution using the production, negative electrode aggregation used the same, secondary battery, and electrode of the same
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Application No.: US13965291Application Date: 2013-08-13
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Publication No.: US09890463B2Publication Date: 2018-02-13
- Inventor: Akitoshi Suzuki , Kensaku Shinozaki , Kimiko Fujisawa , Takahiro Tsuruta , Takeshi Ezura , Jun Shinozaki , Masato Ebisugi , Hirokazu Sasaki , Satoshi Yamazaki
- Applicant: Furukawa Electric Co., LTD.
- Applicant Address: JP Tokyo
- Assignee: Furukawa Electric Co., LTD.
- Current Assignee: Furukawa Electric Co., LTD.
- Current Assignee Address: JP Tokyo
- Agency: Oblon, McClelland, Maier & Neustadt, L.L.P.
- Priority: JP2011-166523 20110729; JP2011-238491 20111031; JP2012-052765 20120309; JP2012-074173 20120328
- Main IPC: H01M4/04
- IPC: H01M4/04 ; C25D3/56 ; C25D3/58 ; C25D7/06 ; H01M4/66 ; C22C9/00 ; C25D1/04 ; C22C1/02 ; H01M4/134 ; H01M10/052 ; H05K3/02

Abstract:
The invention relates to an electrolytic copper alloy foil having large mechanical strength in an ordinary state and showing resistant to heat deterioration even when it is heated to 300° C. or more. That electrolytic copper alloy foil, which contains tungsten copper, preferably incorporates tungsten into copper foil as a copper alloy, has a tensile strength at ordinary temperature of 650 MPa, has a tensile strength after heat treatment at 300° C. for 1 hour of 450 MPa or more, and has a conductivity of 80% or more. Further preferably, the electrolytic copper foil has an elongation at ordinary temperature of 2.5% or more and an elongation after treatment at 300° C. for 1 hour of 3.5% or more. The electrolytic copper foil is produced by adding a thiourea compound, tungsten salt, and chloride ions to a sulfuric acid-copper sulfate electrolyte and performing electrolytic deposition.
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