Invention Grant
- Patent Title: Substrate heating apparatus
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Application No.: US14366573Application Date: 2013-06-26
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Publication No.: US09890998B2Publication Date: 2018-02-13
- Inventor: Yu Jiao , Yanming Wang , Qingyang Yao , Jie Liu
- Applicant: BOE TECHNOLOGY GROUP CO., LTD. , BEIJING BOE OPTOELECTRONICS TECHNOLOGY CO., LTD.
- Applicant Address: CN Beijing CN Beijing
- Assignee: BOE TECHNOLOGY GROUP CO., LTD.,BEIJING BOE OPTOELECTRONICS TECHNOLOGY CO., LTD.
- Current Assignee: BOE TECHNOLOGY GROUP CO., LTD.,BEIJING BOE OPTOELECTRONICS TECHNOLOGY CO., LTD.
- Current Assignee Address: CN Beijing CN Beijing
- Agency: Ladas & Parry LLP
- Priority: CN201310144082 20130423
- International Application: PCT/CN2013/077954 WO 20130626
- International Announcement: WO2014/172988 WO 20141030
- Main IPC: F26B21/02
- IPC: F26B21/02 ; F26B21/12 ; F26B21/14 ; F26B23/04 ; F26B25/06 ; F26B21/00

Abstract:
A substrate heating apparatus includes: a heating chamber, as well as a heating unit and a suspension holding unit which are provided in the heating chamber. The heating unit is provided at the bottom of the heating chamber, and the suspension holding unit holds the substrate in suspension above the heating unit. The apparatus avoids collision and friction on the substrate, and ensures uniform heating of the substrate.
Public/Granted literature
- US20150211792A1 SUBSTRATE HEATING APPARATUS Public/Granted day:2015-07-30
Information query
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