- Patent Title: Profile measuring apparatus, structure manufacturing system, method for measuring profile, method for manufacturing structure, and non-transitory computer readable medium
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Application No.: US13648674Application Date: 2012-10-10
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Publication No.: US09891043B2Publication Date: 2018-02-13
- Inventor: Hiroshi Aoki
- Applicant: NIKON CORPORATION
- Applicant Address: JP Tokyo
- Assignee: NIKON CORPORATION
- Current Assignee: NIKON CORPORATION
- Current Assignee Address: JP Tokyo
- Agency: Finnegan, Henderson, Farabow, Garrett & Dunner, LLP
- Priority: JP2011-223956 20111011
- Main IPC: G01B11/24
- IPC: G01B11/24 ; G01B11/25

Abstract:
There is provided a form measuring apparatus including: an imager configured to take an image of a object, an irradiator configured to irradiate a measurement light from a projection direction different from the direction along which the imager performs imaging to form a predetermined light amount distribution on the object, a reference light generator configured to generate a reference light to irradiate the object, and a detector configured to detect a target area for form measurement of the object based on a pickup image taken by the imager as the reference light is irradiated on the object.
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