A high-density sensor module includes a substrate with a printed circuit board, a first supporting member disposed on a upper surface of the printed circuit board, the first supporting member includes at least one first sensing channel with a first right sidewall, at least one sensor disposed on the first right sidewall and electrically connected to the printed circuit board, and at least one first conductive unit arranged in the first sensing channel. The angle between the first right sidewall and the upper surface of the printed circuit board is not less than 90°. When the first conductive unit is subjected to a pressure from outsides, the first conductive unit slides along a direction toward the upper surface of the printed circuit board and presses the sensors, and the pressure is conductive from the first conductive unit to the sensor. The sensing density and sensing resolution are enhanced.