Invention Grant
- Patent Title: High performance interconnect physical layer
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Application No.: US15193697Application Date: 2016-06-27
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Publication No.: US09892086B2Publication Date: 2018-02-13
- Inventor: Venkatraman Iyer , Darren S. Jue , Rahul Shah , Arvind Kumar
- Applicant: Intel Corporation
- Applicant Address: US CA Santa Clara
- Assignee: Intel Corporation
- Current Assignee: Intel Corporation
- Current Assignee Address: US CA Santa Clara
- Agency: Alliance IP, LLC
- Main IPC: G06F9/44
- IPC: G06F9/44 ; G06F13/42 ; G06F12/0831 ; G06F9/30 ; G06F12/0806 ; H04L12/933 ; G06F9/46 ; G06F13/40 ; G06F12/0813 ; G06F12/0815 ; G06F9/445 ; H04L12/741 ; H04L12/46
Abstract:
A serial data link is to be adapted during initialization of the link. Adaptation of the link is to include receiving a pseudorandom binary sequence (PRBS) from a remote agent, analyzing the PRBS to identify characteristics of the data link, and generating metric data describing the characteristics.
Public/Granted literature
- US20170083476A1 HIGH PERFORMANCE INTERCONNECT PHYSICAL LAYER Public/Granted day:2017-03-23
Information query
