A bonding device and bonding method for bonding an FPC film on a display panel through an anisotropic conductor attached to the display panel, the device including a panel supporting unit configured to support the display panel; a heating and pressurizing unit disposed on an upper area of the panel supporting unit and configured to pressurize and heat a compression area of the FPC film placed on an upper part of the anisotropic conductor towards the display panel, a film supporting unit disposed adjacent the panel supporting unit and configured to support the FPC film, and a film pre-heating unit provided in the film supporting unit and configured to pre-heat the FPC film.