Invention Grant
- Patent Title: ROM chip manufacturing structures
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Application No.: US15216470Application Date: 2016-07-21
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Publication No.: US09893059B2Publication Date: 2018-02-13
- Inventor: Jhon Jhy Liaw
- Applicant: Taiwan Semiconductor Manufacturing Company, Ltd.
- Applicant Address: TW Hsin-Chu
- Assignee: Taiwan Semiconductor Manufacturing Company, Ltd.
- Current Assignee: Taiwan Semiconductor Manufacturing Company, Ltd.
- Current Assignee Address: TW Hsin-Chu
- Agency: Slater Matsil, LLP
- Main IPC: G11C17/00
- IPC: G11C17/00 ; H01L27/088 ; G11C17/08 ; H01L21/768 ; H01L23/528 ; H01L23/522 ; G11C5/06 ; H01L27/112 ; H01L29/78

Abstract:
An integrated circuit (IC) chip embodiment includes first and second ROM cells arranged in a same row of a ROM array. The first and second ROM cells include first portions of first and second gate structures, respectively. The IC chip further includes a strap cell disposed between the first and second ROM cells. The strap cell includes second portions of the first and second gate structures. The first gate structure is physically separated from the second gate structure.
Public/Granted literature
- US20160329325A1 ROM Chip Manufacturing Structures Public/Granted day:2016-11-10
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