Invention Grant
- Patent Title: Multi-Fin device and method of making same
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Application No.: US15096100Application Date: 2016-04-11
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Publication No.: US09893061B2Publication Date: 2018-02-13
- Inventor: Chi-Wen Liu , Chao-Hsiung Wang
- Applicant: Taiwan Semiconductor Manufacturing Company, Ltd.
- Applicant Address: TW Hsin-Chu
- Assignee: Taiwan Semiconductor Manufacturing Company, Ltd.
- Current Assignee: Taiwan Semiconductor Manufacturing Company, Ltd.
- Current Assignee Address: TW Hsin-Chu
- Agency: Slater Matsil, LLP
- Main IPC: H01L27/088
- IPC: H01L27/088 ; H01L29/20 ; H01L21/8234 ; H01L29/66 ; H01L29/06 ; H01L29/22

Abstract:
A multiple-fin device includes a substrate and a plurality of fins formed on the substrate. Source and drain regions are formed in the respective fins. A dielectric layer is formed on the substrate. The dielectric layer has a first thickness adjacent one side of a first fin and having a second thickness, different from the first thickness, adjacent an opposite side of the fin. A continuous gate structure is formed overlying the plurality of fins, the continuous gate structure being adjacent a top surface of each fin and at least one sidewall surface of at least one fin. By adjusting the dielectric layer thickness, channel width of the resulting device can be fine-tuned.
Public/Granted literature
- US20160225765A1 Multi-Fin Device and Method of Making Same Public/Granted day:2016-08-04
Information query
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