Invention Grant
- Patent Title: Image sensor chip scale packages and related methods
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Application No.: US15621041Application Date: 2017-06-13
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Publication No.: US09893115B2Publication Date: 2018-02-13
- Inventor: Swarnal Borthakur
- Applicant: SEMICONDUCTOR COMPONENTS INDUSTRIES, LLC
- Applicant Address: US AZ Phoenix
- Assignee: SEMICONDUCTOR COMPONENTS INDUSTRIES, LLC
- Current Assignee: SEMICONDUCTOR COMPONENTS INDUSTRIES, LLC
- Current Assignee Address: US AZ Phoenix
- Agency: IPTechLaw
- Main IPC: H01L27/146
- IPC: H01L27/146 ; H01L23/31 ; H01L23/00 ; H01L21/66

Abstract:
Methods of forming an image sensor chip scale package. Implementations may include providing a semiconductor wafer having a pixel array, forming a first cavity through the wafer and/or one or more layers coupled over the wafer, filling the first cavity with a fill material, planarizing the fill material and/or the one or more layers to form a first surface of the fill material coplanar with a first surface of the one or more layers, and bonding a transparent cover over the fill material and the one or more layers. The bond may be a fusion bond between the transparent cover and a passivation oxide; a fusion bond between the transparent cover and an anti-reflective coating; a bond between the transparent cover and an organic adhesive coupled over the fill material, and/or; a bond between a first metallized surface of the transparent cover and a metallized layer coupled over the wafer.
Public/Granted literature
- US20170352698A1 IMAGE SENSOR CHIP SCALE PACKAGES AND RELATED METHODS Public/Granted day:2017-12-07
Information query
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