Invention Grant
- Patent Title: Semiconductor device having a channel separation trench
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Application No.: US15187889Application Date: 2016-06-21
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Publication No.: US09893178B2Publication Date: 2018-02-13
- Inventor: Andreas Meiser , Till Schloesser , Franz Hirler
- Applicant: Infineon Technologies AG
- Applicant Address: DE Neubiberg
- Assignee: Infineon Technologies AG
- Current Assignee: Infineon Technologies AG
- Current Assignee Address: DE Neubiberg
- Agency: Murphy, Bilak & Homiller, PLLC
- Main IPC: H01L29/76
- IPC: H01L29/76 ; H01L29/94 ; H01L27/108 ; H01L29/423 ; H01L29/78 ; H01L29/40 ; H01L29/06 ; H01L29/10 ; H01L29/808 ; H01L27/088 ; H01L29/08 ; H01L29/417

Abstract:
A semiconductor device includes a transistor formed in a semiconductor substrate having a main surface. The transistor includes a source region of a first conductivity type, a drain region of the first conductivity type, a channel region of a second conductivity type, a gate trench adjacent to a first sidewall of the channel region, a gate conductive material disposed in the gate trench, the gate conductive material being connected to a gate terminal, and a channel separation trench adjacent to a second sidewall of the channel region. The second sidewall faces the first sidewall via the channel region. The channel separation trench is filled with an insulating separation trench filling consisting of an insulating material in direct contact with the channel region. The source region and the drain region are disposed along a first direction. The first direction is parallel to the main surface.
Public/Granted literature
- US20160300944A1 Semiconductor Device Having a Channel Separation Trench Public/Granted day:2016-10-13
Information query
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