Invention Grant
- Patent Title: Semiconductor structure and manufacturing method thereof
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Application No.: US14328061Application Date: 2014-07-10
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Publication No.: US09893183B2Publication Date: 2018-02-13
- Inventor: Shin-Jiun Kuang , Tsung-Hsing Yu , Yi-Ming Sheu
- Applicant: TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY LTD.
- Applicant Address: TW Hsinchu
- Assignee: TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY LTD.
- Current Assignee: TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY LTD.
- Current Assignee Address: TW Hsinchu
- Agency: WPAT, P.C., Intellectual Property Attorneys
- Agent Anthony King
- Main IPC: H01L29/78
- IPC: H01L29/78 ; H01L29/08 ; H01L21/02 ; H01L29/66 ; H01L29/165

Abstract:
Some embodiments of the present disclosure provide a semiconductor structure including a substrate and an epitaxy region partially disposed in the substrate. The epitaxy region includes a substance with a lattice constant that is larger than a lattice constant of the substrate. The concentration profile of a substance in the epitaxy region is monotonically increasing from a bottom portion of the epitaxy region to a of the epitaxy region. A first layer of the epitaxy region has a height to width ratio of about 2. The first layer is a layer positioned closest to the substrate, and the first layer has an average concentration of the substance from about 20 to about 32 percent. A second layer disposed over the first layer. The second layer has a bottom portion with a concentration of the substance from about 27 percent to about 37 percent.
Public/Granted literature
- US20160013316A1 SEMICONDUCTOR STRUCTURE AND MANUFACTURING METHOD THEREOF Public/Granted day:2016-01-14
Information query
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