Invention Grant
- Patent Title: Connector system capable of mitigating signal deterioration
-
Application No.: US14649625Application Date: 2013-11-19
-
Publication No.: US09893475B2Publication Date: 2018-02-13
- Inventor: Kazuaki Toba , Taichi Hirano , Akira Matsuda
- Applicant: SONY CORPORATION
- Applicant Address: JP Tokyo
- Assignee: SONY CORPORATION
- Current Assignee: SONY CORPORATION
- Current Assignee Address: JP Tokyo
- Agency: Chip Law Group
- Priority: JP2012-283320 20121226
- International Application: PCT/JP2013/081219 WO 20131119
- International Announcement: WO2014/103566 WO 20140703
- Main IPC: H01R24/00
- IPC: H01R24/00 ; H01R33/00 ; H01R13/66 ; H01R13/6471 ; H01R13/6585 ; H01R24/60
Abstract:
There is provided a connector including a signal pin that stretches in a first direction and transmits a signal, a substrate that has one surface on which the signal pin is formed, and an electric conductor layer that has ground potential, the electric conductor layer being formed on an opposite surface of the surface of the substrate on which the signal pin is formed.
Public/Granted literature
Information query
