An Anisotropic Conductive Film (ACF) is stuck to a substrate by: under-receiving the substrate on which a film-shaped component is mounted by a under-receiving section, increasing an interval between a sticking head and the under-receiving section in the under-receiving step; transporting a tape member in which a base tape is bonded to the ACF and causing a sticking surface of the ACF to face the substrate, pressing the ACF together with the base tape on the substrate and sticking the ACF to the substrate, peeling the ACF sticking to the substrate from the base tape by moving a peeling member in a horizontal direction by causing the peeling member to be interposed between the ACF and the base tape, and regulating an upward warpage deformation of the component during peeling the ACF from the base tape by moving the peeling member.