An Anisotropic Conductive Film (ACF) is stuck to a substrate by: under-receiving the substrate on which a film-shaped component is mounted by a under-receiving section, transporting a tape member in which a base tape is bonded to the ACF by a tape transport section and causing a sticking surface of the ACF to face the substrate, pressing the ACF together with the base tape on the substrate by a pressing tool and sticking the ACF to the substrate, peeling the ACF sticking to the substrate from the base tape by moving a peeling member in a horizontal direction by causing the peeling member to be interposed between the ACF and the base tape, and regulating an upward warpage deformation of the component during peeling the ACF from the base tape by moving the peeling member.