Invention Grant
- Patent Title: Implementation method for stacked connection between isolated circuit components and the circuit thereof
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Application No.: US15258788Application Date: 2016-09-07
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Publication No.: US09894791B2Publication Date: 2018-02-13
- Inventor: Yipu Zheng
- Applicant: SHENZHEN XILONG TOY COMPANY LIMITED
- Applicant Address: CN Shenzhen
- Assignee: SHENZHEN XILONG TOY COMPANY LIMITED
- Current Assignee: SHENZHEN XILONG TOY COMPANY LIMITED
- Current Assignee Address: CN Shenzhen
- Agency: Anova Law Group, PLLC
- Priority: CN201610259246 20160425
- Main IPC: H01L23/02
- IPC: H01L23/02 ; H05K7/00 ; H01L25/16 ; H01L23/482 ; H01L23/00

Abstract:
The present invention discloses an implementation method for stacked connection between isolated circuit components, whose setting is according to at least two circuit components connecting in parallel/series in a circuit, wherein, in accordance with a circuit connection configuration, a plurality of corresponding pins of the components are soldered directly, making the components form an integrated module in accordance with a desired connection configuration of the circuit, and saving circuit boards and wires. Comparing to the circuit limited in a PCB in the prior art, it is possible to construct a circuit unit by welding connection in a way of building-block approach, achieving a circuit in a 3D space through directly welding between components, and owning a wider design space, it may shorten the time used for a circuit from design to process.
Public/Granted literature
- US20170311470A1 IMPLEMENTATION METHOD FOR STACKED CONNECTION BETWEEN ISOLATED CIRCUIT COMPONENTS AND THE CIRCUIT THEREOF Public/Granted day:2017-10-26
Information query
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