Invention Grant
- Patent Title: Suction nozzle for mounting electronic components
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Application No.: US15110676Application Date: 2014-01-22
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Publication No.: US09894819B2Publication Date: 2018-02-13
- Inventor: Chikashi Teshima , Kenzo Ishikawa
- Applicant: FUJI MACHINE MFG. CO., LTD.
- Applicant Address: JP Chiryu
- Assignee: FUJI MACHINE MFG. CO., LTD.
- Current Assignee: FUJI MACHINE MFG. CO., LTD.
- Current Assignee Address: JP Chiryu
- Agency: Oblon, McClelland, Maier & Neustadt, L.L.P.
- International Application: PCT/JP2014/051279 WO 20140122
- International Announcement: WO2015/111156 WO 20150730
- Main IPC: H05K13/04
- IPC: H05K13/04 ; B25J15/06

Abstract:
A suction nozzle, including a suction assistance section provided within an intake passage and connecting a side downstream of a pin and a side upstream of the pin, is provided. A cross section (the area of a cross section cut in a direction perpendicular to the direction in which the intake passage extends) of the intake passage is narrowed by the pin. Air bypasses the pin by flowing through the suction assistance section.
Public/Granted literature
- US20160353620A1 SUCTION NOZZLE FOR MOUNTING ELECTRONIC COMPONENTS Public/Granted day:2016-12-01
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