Invention Grant
- Patent Title: Systems and methods for edge bead removal
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Application No.: US14258503Application Date: 2014-04-22
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Publication No.: US09908201B2Publication Date: 2018-03-06
- Inventor: Chun-Hao Chang , Hsueh-Yi Chung , Shang-Yun Huang , Jui-Ping Chuang , Li-Kong Turn , Fei-Gwo Tsai
- Applicant: Taiwan Semiconductor Manufacturing Company Limited
- Applicant Address: TW Hsinchu
- Assignee: Taiwan Semiconductor Manufacturing Company Limited
- Current Assignee: Taiwan Semiconductor Manufacturing Company Limited
- Current Assignee Address: TW Hsinchu
- Agency: Jones Day
- Main IPC: B23K26/36
- IPC: B23K26/36 ; B23K26/361 ; B23K26/362 ; B23K26/38 ; B23K103/00
Abstract:
Systems and methods are provided for edge bead removal. A laser beam of approximately a wavelength is received. The laser beam is delivered along a predetermined beam path. The laser beam is projected on an edge portion of a wafer for edge bead removal.
Public/Granted literature
- US20150298262A1 SYSTEMS AND METHODS FOR EDGE BEAD REMOVAL Public/Granted day:2015-10-22
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