Processes for bonding lignocellulosic substrates without an added adhesive are described. The processes of the invention may include exposing the surfaces of the lignocellulosic substrate to a rapid heating source to cause one or more physical, chemical, or other modifications on the surface of the substrate. As a result of the modifications, the surfaces may form a bond with another substrate under elevated temperatures and pressures, for example, produced by a means for pressing such as a conventional hot press used in the woodworking arts. The processes allow a variety of composites such as wood materials for use in the furniture making or construction industries to be manufactured. As the processes forgo the need for petroleum-based adhesives, they are more environmentally sound and occupationally safe than prior art wood product manufacturing methods. Additionally, composite materials made by the processes of the invention are described.