Invention Grant
- Patent Title: Inertial and pressure sensors on single chip
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Application No.: US14504545Application Date: 2014-10-02
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Publication No.: US09908771B2Publication Date: 2018-03-06
- Inventor: Ando Feyh , Gary O'Brien
- Applicant: Robert Bosch GmbH
- Applicant Address: DE Stuttgart
- Assignee: Robert Bosch GmbH
- Current Assignee: Robert Bosch GmbH
- Current Assignee Address: DE Stuttgart
- Agency: Maginot Moore & Beck LLP
- Main IPC: B61B7/02
- IPC: B61B7/02 ; B81B7/02 ; G01D21/02 ; G01P15/08 ; G01P15/125 ; G01P15/18 ; G01C25/00 ; G01L19/00 ; G01L19/12

Abstract:
In accordance with one embodiment, a single chip combination inertial and pressure sensor device includes a substrate, an inertial sensor including a movable sensing structure movably supported above the substrate, and a first fixed electrode positioned adjacent to the movable sensing structure, and a pressure sensor including a gap formed in the sensor at a location directly above the movable sensing structure, and a flexible membrane formed in a cap layer of the device, the flexible membrane defining a boundary of the gap and configured to flex toward and away from the gap in response to a variation in pressure above the flexible membrane.
Public/Granted literature
- US20150096376A1 Inertial and Pressure Sensors on Single Chip Public/Granted day:2015-04-09
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