Invention Grant
- Patent Title: Cured thermoset for high thermal conductive materials
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Application No.: US15108794Application Date: 2013-12-30
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Publication No.: US09908988B2Publication Date: 2018-03-06
- Inventor: Wei Liu , Xiaomei Song , Hongyu Chen , Yan Huang , Yu Zhang
- Applicant: Dow Global Technologies LLC , Rohm and Haas Company
- Applicant Address: US MI Midland US PA Philadelphia
- Assignee: Dow Global Technologies LLC,Rohm and Haas Company
- Current Assignee: Dow Global Technologies LLC,Rohm and Haas Company
- Current Assignee Address: US MI Midland US PA Philadelphia
- Agent S. Matthew Cairns
- International Application: PCT/CN2013/090956 WO 20131230
- International Announcement: WO2015/100555 WO 20150709
- Main IPC: C08K3/28
- IPC: C08K3/28 ; C08L63/00 ; H01L33/64 ; H01L23/373 ; C08K3/22 ; C08K5/435 ; C08G59/24 ; C08G59/50

Abstract:
An article having a heat source and an electrically insulating thermal management component located in proximity to the heart source. The thermal management component contains a cured thermoset formed from a composition containing (a) a diglycidyl compound which has mesogenic structure and melting point of the diglycidyl compound is 150° C. or less, (b) a hardener and (c) an inorganic filler having specific thermal conductivity. The cured thermoset has high thermal conductivity.
Public/Granted literature
- US20160326339A1 CURED THERMOSET FOR HIGH THERMAL CONDUCTIVE MATERIALS Public/Granted day:2016-11-10
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