Invention Grant
- Patent Title: Resin composition and resin molded object
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Application No.: US14420562Application Date: 2013-07-18
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Publication No.: US09909005B2Publication Date: 2018-03-06
- Inventor: Atsushi Yamada , Kenji Ueda , Takahiro Ohe , Yasuhito Inagaki
- Applicant: Sony Corporation
- Applicant Address: JP Tokyo
- Assignee: SONY CORPORATION
- Current Assignee: SONY CORPORATION
- Current Assignee Address: JP Tokyo
- Agency: Dentons US LLP
- Priority: JP2012-192684 20120831
- International Application: PCT/JP2013/004397 WO 20130718
- International Announcement: WO2014/034012 WO 20140306
- Main IPC: C08L69/00
- IPC: C08L69/00

Abstract:
A halogen-free type polycarbonate resin composition and a resin molded object having good flame retardant properties and physical properties that make them suitable for the use as manufactured products. The resin component includes a component A which is a polycarbonate resin, a component B including organic sulfonic acid or organic sulfonic acid metal salt, whose content is 0.05% or more and 2.0% or less by weight, a component C which is a drip inhibitor, whose content is 0.05% or more and 1.0% or less by weight, and a component D which is a silicone compound, whose content is 0.1% or more and 2.0% or less by weight. Among hydrogen atoms in the silicone compound and the proportion of hydrogen atoms in phenyl groups is 51% or more.
Public/Granted literature
- US20150210850A1 RESIN COMPOSITION AND RESIN MOLDED OBJECT Public/Granted day:2015-07-30
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