Invention Grant
- Patent Title: Ephemeral bonding
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Application No.: US14992251Application Date: 2016-01-11
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Publication No.: US09909040B2Publication Date: 2018-03-06
- Inventor: Zhifeng Bai , Mark S. Oliver , Michael K. Gallagher , Christopher J. Tucker , Karen R. Brantl , Elissei Iagodkine , Zidong Wang
- Applicant: Rohm and Haas Electronic Materials LLC , Dow Global Technologies LLC
- Applicant Address: US MA Marlborough US MI Midland
- Assignee: Rohm and Haas Electronic Materials LLC,Dow Global Technologies LLC
- Current Assignee: Rohm and Haas Electronic Materials LLC,Dow Global Technologies LLC
- Current Assignee Address: US MA Marlborough US MI Midland
- Agent S. Matthew Cairns
- Main IPC: C08L71/02
- IPC: C08L71/02 ; C09J11/08 ; C09J143/04 ; C09J5/06 ; H01L21/683 ; B32B7/06 ; B32B7/12 ; C08K5/06 ; C09J171/02 ; C09J125/18
Abstract:
Compositions containing an adhesive material, a release additive and a compatibilizer are suitable for temporarily bonding two surfaces, such as a wafer active side and a substrate. These compositions are useful in the manufacture of electronic devices where a temporary bonding of a component to a substrate is desired.
Public/Granted literature
- US20160122601A1 EPHEMERAL BONDING Public/Granted day:2016-05-05
Information query
