Polymer etchant and method of using same

Invention Grant

US09909063B2 Polymer etchant and method of using same 有权

Patent Title: Polymer etchant and method of using same
Application No.: US13882068

Application Date: 2011-10-18
Publication No.: US09909063B2

Publication Date: 2018-03-06
Inventor: Ravi Palaniswamy
Applicant: Ravi Palaniswamy
Applicant Address: US MN St. Paul
Assignee: 3M INNOVATIVE PROPERTIES COMPANY
Current Assignee: 3M INNOVATIVE PROPERTIES COMPANY
Current Assignee Address: US MN St. Paul
Agent Clifton F. Richardson; Melanie G. Gover
International Application: PCT/US2011/056743 WO 20111018
International Announcement: WO2012/061010 WO 20120510
Main IPC: H01L21/302
IPC: H01L21/302 ; H01L21/461 ; B44C1/22 ; C03C15/00 ; C03C25/68 ; C23F1/00 ; C09K13/02 ; H01L21/3213 ; H01L21/02 ; H01L21/311 ; H05K3/00 ; C08J7/14

Abstract:

Provided is a composition for etching polymeric materials comprising an aqueous solution including an alkali metal salt and glycine.

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IPC分类:

H	电学
H01	基本电气元件
H01L	半导体器件；其他类目中不包括的电固体器件（使用半导体器件的测量入G01；一般电阻器入H01C；磁体、电感器、变压器入H01F；一般电容器入H01G；电解型器件入H01G9/00；电池组、蓄电池入H01M；波导管、谐振器或波导型线路入H01P；线路连接器、汇流器入H01R；受激发射器件入H01S；机电谐振器入H03H；扬声器、送话器、留声机拾音器或类似的声机电传感器入H04R；一般电光源入H05B；印刷电路、混合电路、电设备的外壳或结构零部件、电气元件的组件的制造入H05K；在具有特殊应用的电路中使用的半导体器件见应用相关的小类）
H01L21/00	专门适用于制造或处理半导体或固体器件或其部件的方法或设备
H01L21/02	.半导体器件或其部件的制造或处理
H01L21/04	..至少具有一个跃变势垒或表面势垒的器件，例如PN结、耗尽层、载体集结层
H01L21/18	...器件有由周期表Ⅳ族元素或含有/不含有杂质的AⅢBⅤ族化合物构成的半导体，如掺杂材料
H01L21/30	....用H01L21/20至H01L21/26各组不包含的方法或设备处理半导体材料的（在半导体材料上制作电极的入H01L21/28）
H01L21/302	.....改变半导体材料的表面物理特性或形状的，例如腐蚀、抛光、切割