- Patent Title: Supporting unit and substrate treating apparatus including the same
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Application No.: US14974023Application Date: 2015-12-18
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Publication No.: US09909197B2Publication Date: 2018-03-06
- Inventor: Wonhaeng Lee , Kang Rae Ha
- Applicant: Semes Co., Ltd.
- Applicant Address: KR Chungcheongnam-do
- Assignee: SEMES CO., LTD.
- Current Assignee: SEMES CO., LTD.
- Current Assignee Address: KR Chungcheongnam-do
- Agency: Harness, Dickey & Pierce, P.L.C.
- Priority: KR10-2014-0186104 20141222; KR10-2015-0137803 20150930
- Main IPC: B23K31/02
- IPC: B23K31/02 ; C22C29/12 ; H02N13/00 ; B23K35/32 ; B23K35/28 ; C22C29/02 ; H01J37/32 ; H01L21/67 ; H01L21/683 ; H01L21/687 ; B32B15/00 ; C22C49/06 ; C22C49/14
Abstract:
A fabrication method of a supporting unit supporting a substrate is provided. The fabrication method includes providing a supporting plate that is made of a non-conductive material and configured to support the substrate, providing a base plate that is disposed under the supporting plate and made of a material containing a conductive material, and forming a first metal film on a top surface of the base plate and bonding the supporting plate with the base plate through a brazing process.
Public/Granted literature
- US20160181137A1 SUPPORTING UNIT AND SUBSTRATE TREATING APPARATUS INCLUDING THE SAME Public/Granted day:2016-06-23
Information query
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