A vapor deposition apparatus including: a chamber that holds an object on which a film is to be deposited through vapor deposition; a vapor deposition source that is disposed inside the chamber, the vapor deposition source having a housing that accommodates therein a vapor deposition material for the vapor deposition; and a heater that heats the vapor deposition material. The housing has a plurality of eject outlets and an air outlet that is openable and closable, the plurality of eject outlets connecting the inside of the housing with the outside of the housing and ejecting vapor of the vapor deposition material towards the object.