- Patent Title: Process kit having tall deposition ring and deposition ring clamp
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Application No.: US15201019Application Date: 2016-07-01
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Publication No.: US09909206B2Publication Date: 2018-03-06
- Inventor: William Johanson , Kirankumar Savandaiah , Adolph Miller Allen , Xin Wang , Prashant Prabhu
- Applicant: APPLIED MATERIALS, INC.
- Applicant Address: US CA Santa Clara
- Assignee: APPLIED MATERIALS, INC.
- Current Assignee: APPLIED MATERIALS, INC.
- Current Assignee Address: US CA Santa Clara
- Agency: Moser Taboada
- Agent Alan Taboada
- Priority: IN2029/DEL/2015 20150703
- Main IPC: H01J37/34
- IPC: H01J37/34 ; C23C14/34 ; C23C14/56 ; H01J37/32

Abstract:
Embodiments of process kits and process chambers incorporating same are provided herein. In some embodiments, a process kit includes a deposition ring configured to be disposed on a substrate support designed to support a substrate having a given width, including: an annular band configured to rest on a lower ledge of the substrate support; an inner lip extending upwardly from an inner edge of the annular band, wherein an inner surface of the inner lip and an inner surface of the annular band together form a central opening having a width that is less than the given width, and wherein a depth between an upper surface of the annular band and an upper surface of the inner lip is between about 24 mm and about 38 mm; a channel disposed radially outward of the annular band; and an outer lip extending upwardly and disposed radially outward of the channel.
Public/Granted literature
- US20170002461A1 PROCESS KIT HAVING TALL DEPOSITION RING AND DEPOSITION RING CLAMP Public/Granted day:2017-01-05
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