Invention Grant
- Patent Title: Recursive pumping for symmetrical gas exhaust to control critical dimension uniformity in plasma reactors
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Application No.: US14452228Application Date: 2014-08-05
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Publication No.: US09909213B2Publication Date: 2018-03-06
- Inventor: Sergio Fukuda Shoji , Hamid Noorbakhsh , Jong Mun Kim , Jason Della Rosa , Ajit Balakrishna
- Applicant: Applied Materials, Inc.
- Applicant Address: US CA Santa Clara
- Assignee: Applied Materials, Inc.
- Current Assignee: Applied Materials, Inc.
- Current Assignee Address: US CA Santa Clara
- Agency: Patterson + Sheridan, LLP
- Main IPC: C23C16/44
- IPC: C23C16/44 ; C23C16/455 ; F15D1/02 ; H01J37/32

Abstract:
Embodiments of the present invention provide apparatus and methods for reducing non-uniformity and/or skews during substrate processing. One embodiment of the present invention provides a flow equalizer assembly for disposing between a vacuum port and a processing volume in a processing chamber. The flow equalizing assembly includes a first plate having at least one first opening, and a second plate having two or more second openings. The first and second plates define a flow redistributing volume therebetween, and the at least one first opening and the two or more second openings are staggered.
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