Invention Grant
- Patent Title: Ceiling system
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Application No.: US15420440Application Date: 2017-01-31
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Publication No.: US09909311B2Publication Date: 2018-03-06
- Inventor: Christopher D. Gaydos , Brian L. Springer , Lori Jo L. Shearer , Scott L. Huntzinger
- Applicant: ARMSTRONG WORLD INDUSTRIES, INC.
- Applicant Address: US DE Wilmington
- Assignee: AWI Licensing LLC
- Current Assignee: AWI Licensing LLC
- Current Assignee Address: US DE Wilmington
- Agent Craig M. Sterner
- Main IPC: E04B9/04
- IPC: E04B9/04 ; B32B3/06 ; B32B7/12 ; B32B7/04 ; B32B5/02 ; E04B9/24 ; E04B9/06

Abstract:
A ceiling system includes a grid support member, and first and second ceiling panels abutted at a joint. In the factory-supplied condition, each panel has a facing sheet already adhesively bonded to a central region of the panel. Perimeter portions of the facing are left un-bonded to an annular peripheral region of the surface surrounding the central region. This allows seams to be made in the field. The facing sheet comprises a cantilevered flap extending beyond a peripheral edge of the panel. During field installation, the flap of a first panel extends across the joint overlapping the second panel's un-bonded facing sheet in the peripheral region. The double thickness of facings is cut to form a seam laterally offset from the joint, which is concealed. A field applied or activated adhesive bonds the facing to the peripheral regions of each panel. A related installation method is disclosed.
Public/Granted literature
- US20170342710A1 CEILING SYSTEM Public/Granted day:2017-11-30
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