A machine includes a machine substrate and a dielectric layer formed over at least a portion of the machine substrate. A monitoring system for the machine includes a sensor subsystem that includes a first portion of the machine substrate and a portion of the machine dielectric layer formed over the first portion of the machine substrate. The monitoring system also includes a sensor electromagnetic structure disposed on the portion of the machine dielectric layer. The sensor electromagnetic structure includes at least one sensor conducting subcomponent. The sensor electromagnetic structure is configured to regulate electromagnetic fields incident thereto in response to at least one measurement characteristic of a machine measurand. The sensor subsystem is configured to obtain at least one measurement characteristic of the machine measurand proximate a machine sensing position.