Invention Grant
- Patent Title: Componentized junction models
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Application No.: US14990301Application Date: 2016-01-07
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Publication No.: US09909894B2Publication Date: 2018-03-06
- Inventor: Robin Kim , Michael Limber , Jeff Bach
- Applicant: HERE Global B.V.
- Applicant Address: NL Eindhoven
- Assignee: HERE Global B.V.
- Current Assignee: HERE Global B.V.
- Current Assignee Address: NL Eindhoven
- Agency: Lempia Summerfield Katz LLC
- Main IPC: G01C21/36
- IPC: G01C21/36

Abstract:
In one embodiment, a method is provided for componentized junction models. A plurality of road junction configurations are defined with a different set of road segment models corresponding to each of the plurality of road junction configurations. One of the plurality of road junction configurations are selected for a route through a physical road junction. A model of the physical road junction is generated by assembling the set of road segment models corresponding to the selected road junction configuration. The three-dimensional model of the physical road junction is rendered.
Public/Granted literature
- US20170199051A1 Componentized Junction Models Public/Granted day:2017-07-13
Information query
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