Invention Grant
- Patent Title: Apparatus and method for terminating probe apparatus of semiconductor wafer
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Application No.: US15062423Application Date: 2016-03-07
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Publication No.: US09910067B2Publication Date: 2018-03-06
- Inventor: Bryan J. Root , William A. Funk
- Applicant: Celadon Systems, Inc.
- Applicant Address: US MN Burnsville
- Assignee: Celadon Systems, Inc.
- Current Assignee: Celadon Systems, Inc.
- Current Assignee Address: US MN Burnsville
- Agency: Hamre, Schumann, Mueller & Larson, P.C.
- Main IPC: G01R31/00
- IPC: G01R31/00 ; G01R1/04 ; G01R31/28 ; G01R1/067 ; G01R31/26

Abstract:
A probe apparatus and method of terminating a probe that probes a semiconductor device with a signal cable from a tester side by side at a proximal end of the probe and a distal end of the signal cable. In one embodiment, the probe apparatus includes: a chassis; a dielectric block mounted in the chassis for retaining the probe, the probe extending on the chassis from a proximal end of the probe to the dielectric block, extending through the dielectric block, and projecting from the dielectric block towards the semiconductor device at a distal end of the probe; and a terminating apparatus, mounted in the chassis, for terminating the proximal end of the probe with a distal end of the signal cable side by side.
Public/Granted literature
- US20160187379A1 APPARATUS AND METHOD FOR TERMINATING PROBE APPARATUS OF SEMICONDUCTOR WAFER Public/Granted day:2016-06-30
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