Invention Grant
- Patent Title: Signed division in memory
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Application No.: US15073191Application Date: 2016-03-17
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Publication No.: US09910637B2Publication Date: 2018-03-06
- Inventor: Sanjay Tiwari
- Applicant: Micron Technology, Inc.
- Applicant Address: US ID Boise
- Assignee: Micron Technology, Inc.
- Current Assignee: Micron Technology, Inc.
- Current Assignee Address: US ID Boise
- Agency: Brooks, Cameron & Huebsch, PLLC
- Main IPC: G06F7/535
- IPC: G06F7/535

Abstract:
Examples of the present disclosure provide apparatuses and methods for performing signed division operations. An apparatus can include a first group of memory cells coupled to a first access line and a number of sense lines. The apparatus can include a second group of memory cells coupled to a second access line and the number of sense lines. The apparatus can include a controller configured to cause sensing circuitry to divide a signed dividend element stored in the first group of memory cells by a signed divisor element stored in the second group of memory cells by performing a number of operations. At least one of the number of operations can be performed without transferring data via an input/output (I/O) line.
Public/Granted literature
- US20170269903A1 SIGNED DIVISION IN MEMORY Public/Granted day:2017-09-21
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