Invention Grant
- Patent Title: Ring protocol for low latency interconnect switch
-
Application No.: US15583563Application Date: 2017-05-01
-
Publication No.: US09910807B2Publication Date: 2018-03-06
- Inventor: Robert G. Blankenship , Geeyarpuram N. Santhanakrishnan , Yen-Cheng Liu , Bahaa Fahim , Ganapati N. Srinivasa
- Applicant: Intel Corporation
- Applicant Address: US CA Santa Clara
- Assignee: Intel Corporation
- Current Assignee: Intel Corporation
- Current Assignee Address: US CA Santa Clara
- Agency: Law Office of R. Alan Burnett, P.S
- Main IPC: G06F13/40
- IPC: G06F13/40 ; G06F13/16 ; G06F13/42

Abstract:
Methods, systems, and apparatus for implementing low latency interconnect switches between CPU's and associated protocols. CPU's are configured to be installed on a main board including multiple CPU sockets linked in communication via CPU socket-to-socket interconnect links forming a CPU socket-to-socket ring interconnect. The CPU's are also configured to transfer data between one another by sending data via the CPU socket-to-socket interconnects. Data may be transferred using a packetized protocol, such as QPI, and the CPU's may also be configured to support coherent memory transactions across CPU's.
Public/Granted literature
- US20170235695A1 RING PROTOCOL FOR LOW LATENCY INTERCONNECT SWITCH Public/Granted day:2017-08-17
Information query