Invention Grant
- Patent Title: Electronic component
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Application No.: US14296239Application Date: 2014-06-04
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Publication No.: US09911529B2Publication Date: 2018-03-06
- Inventor: Soitsu Sasaki
- Applicant: MURATA MANUFACTURING CO., LTD.
- Applicant Address: JP Kyoto-fu
- Assignee: Murata Manufacturing Co., Ltd.
- Current Assignee: Murata Manufacturing Co., Ltd.
- Current Assignee Address: JP Kyoto-fu
- Agency: Studebaker & Brackett PC
- Priority: JP2012-001405 20120106
- Main IPC: H01F5/00
- IPC: H01F5/00 ; H01F27/28 ; H01F27/02 ; H01F27/29 ; H01F17/00 ; H01F41/04

Abstract:
In an electronic component, a multilayer body is formed by a plurality of stacked insulator layers. A coil includes at least one coil conductor layer provided on at least one of the insulator layers. External electrodes are embedded in a lateral surface of the multilayer body which is formed by a series of continuous perimeter edges of the plurality of insulator layers, and includes a plurality of stacked external conductor layers provided on the plurality of insulator layers. The external electrodes have different shapes. The external conductor layers and the first coil conductor, which are provided on the same insulator layer, are simultaneously formed by photolithography or printing.
Public/Granted literature
- US20140285306A1 ELECTRONIC COMPONENT Public/Granted day:2014-09-25
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