Invention Grant
- Patent Title: Coil component and method of manufacturing the same
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Application No.: US15080035Application Date: 2016-03-24
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Publication No.: US09911530B2Publication Date: 2018-03-06
- Inventor: Ju Hwan Yang , Seok Il Hong , Doo Young Kim , Jae Yeol Choi
- Applicant: SAMSUNG ELECTRO-MECHANICS CO., LTD.
- Applicant Address: KR Suwon-si, Gyeonggi-Do
- Assignee: SAMSUNG ELECTRO-MECHANICS CO., LTD.
- Current Assignee: SAMSUNG ELECTRO-MECHANICS CO., LTD.
- Current Assignee Address: KR Suwon-si, Gyeonggi-Do
- Agency: McDermott Will & Emery LLP
- Priority: KR10-2015-0109049 20150731
- Main IPC: H01F5/00
- IPC: H01F5/00 ; H01F27/28 ; H01F41/04 ; H01F17/00 ; H01F19/04

Abstract:
A coil component includes: a coil part including a first coil layer and a second coil layer disposed above the first coil layer, wherein the first coil layer includes a first insulating layer having a first opening pattern and a first conductive layer disposed in the first opening pattern, and the second coil layer includes a second insulating layer having a second opening pattern, a seed layer covering inner side surfaces and a lower surface of the second opening pattern, and a second conductive layer disposed in the second opening pattern.
Public/Granted literature
- US20170032882A1 COIL COMPONENT AND METHOD OF MANUFACTURING THE SAME Public/Granted day:2017-02-02
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