Invention Grant
- Patent Title: Silicone-based thermal interface materials
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Application No.: US15426249Application Date: 2017-02-07
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Publication No.: US09911681B2Publication Date: 2018-03-06
- Inventor: Sarah K. Czaplewski , Joseph Kuczynski , Jason T. Wertz , Jing Zhang
- Applicant: International Business Machines Corporation
- Applicant Address: US NY Armonk
- Assignee: INTERNATIONAL BUSINESS MACHINES CORPORATION
- Current Assignee: INTERNATIONAL BUSINESS MACHINES CORPORATION
- Current Assignee Address: US NY Armonk
- Agency: Patterson + Sheridan, LLP
- Main IPC: H01L23/44
- IPC: H01L23/44 ; H01L23/373 ; C08G77/44
Abstract:
In an example, a silicone-based thermal interface material includes a thermally conductive material and a silicone-based polymeric material having a solubility parameter that is not less than 9.09 cal1/2 cm−3/2.
Public/Granted literature
- US20170148706A1 SILICONE-BASED THERMAL INTERFACE MATERIALS Public/Granted day:2017-05-25
Information query
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