Invention Grant
- Patent Title: Clip and related methods
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Application No.: US15094022Application Date: 2016-04-08
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Publication No.: US09911712B2Publication Date: 2018-03-06
- Inventor: Chee Hiong Chew , Atapol Prajuckamol , Yushuang Yao
- Applicant: SEMICONDUCTOR COMPONENTS INDUSTRIES, LLC
- Applicant Address: US AZ Phoenix
- Assignee: SEMICONDUCTOR COMPONENTS INDUSTRIES, LLC
- Current Assignee: SEMICONDUCTOR COMPONENTS INDUSTRIES, LLC
- Current Assignee Address: US AZ Phoenix
- Agency: IPTechLaw
- Main IPC: H01L29/73
- IPC: H01L29/73 ; H01L23/49 ; H01L23/00 ; H01L25/065 ; H01L25/07 ; H01L23/495

Abstract:
A clip for a semiconductor package. Implementations may include: an electrically conductive clip having a first end and a second end and a middle section between the first end and the second end. The first end may be configured to couple to a first die through a bonding material. The second end may be configured to couple to a second die through a bonding material. The middle section may be configured to couple to an emitter structure through a bonding material. The clip may include an integrally formed electrically conductive material and include an M-shape. A middle of the M-shape may be coupled to the emitter structure.
Public/Granted literature
- US20170117211A1 CLIP AND RELATED METHODS Public/Granted day:2017-04-27
Information query
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