Electronic devices may include substrates with integrated circuit traces. For example, a component of an electronic device may include a substrate with one or more circuit traces formed on the substrate. A support structure may be embedded in the substrate at a location proximate to at least a part of a circuit trace of the one or more circuit traces. A connector may be affixed to at least the support structure and at least a portion of the part of the circuit trace. This disclosure also describes techniques for assembling substrates with circuit traces and embedded support structures.