Invention Grant
- Patent Title: Module interface
-
Application No.: US15222984Application Date: 2016-07-29
-
Publication No.: US09912085B2Publication Date: 2018-03-06
- Inventor: Mike Gehrke , Jörg Klaiber , Bernd Hermann
- Applicant: Euchner GmbH & Co. KG
- Applicant Address: DE Leinfelden-Echterdingen
- Assignee: Euchner GmbH & Co. KG
- Current Assignee: Euchner GmbH & Co. KG
- Current Assignee Address: DE Leinfelden-Echterdingen
- Agent Michael Soderman
- Priority: DE202015104123U 20150806
- Main IPC: H01R25/00
- IPC: H01R25/00 ; H01R27/02 ; H01R31/00 ; H01R33/00 ; H01R12/71 ; H01R29/00 ; H01R31/06 ; H01R12/75 ; H01R24/76 ; H01R33/88 ; H01R33/94 ; H01R24/54 ; H01R107/00
Abstract:
The invention relates to a module interface with a device-side connector provided on an electronic module with a number of contact elements. They are designed to form a plug-type connection with several corresponding plug-type connectors with different numbers of contact elements.
Public/Granted literature
- US20170040723A1 Module Interface Public/Granted day:2017-02-09
Information query
