Invention Grant
- Patent Title: Shielded conduction path
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Application No.: US15385185Application Date: 2016-12-20
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Publication No.: US09912132B2Publication Date: 2018-03-06
- Inventor: Ryo Kuroishi , Hirokazu Nakai
- Applicant: Sumitomo Wiring Systems, Ltd.
- Applicant Address: JP Yokkaichi, Mie
- Assignee: SUMITOMO WIRING SYSTEMS, LTD.
- Current Assignee: SUMITOMO WIRING SYSTEMS, LTD.
- Current Assignee Address: JP Yokkaichi, Mie
- Agency: Reising Ethington, P.C.
- Priority: JP2015249380 20151222
- Main IPC: H01R4/00
- IPC: H01R4/00 ; H01R4/18 ; H02G3/06 ; H02G15/08 ; H01B7/18 ; H01B9/02 ; H02G3/04 ; H01B7/00 ; B60R16/02

Abstract:
A shielded conduction path that makes it possible to reduce the diameter of a portion where a braided wire is fixed to a pipe. The shielded conduction path includes a pipe that has a shielding function, reduced diameter portions that are formed in the outer circumference of the pipe, braided wires that have a shielding function and are arranged such that the base end portions thereof envelop the outer circumference of the reduced diameter portions, crimp rings that are arranged so as to envelop the outer circumference of the base end portions of the braided wires and fix the braided wires to the reduced diameter portions, and a conduction path main body that is inserted into the pipe and into the braided wires.
Public/Granted literature
- US20170179698A1 SHIELDED CONDUCTION PATH Public/Granted day:2017-06-22
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