Invention Grant
- Patent Title: Power module
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Application No.: US15325310Application Date: 2015-07-01
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Publication No.: US09912248B2Publication Date: 2018-03-06
- Inventor: Hiromi Shimazu , Kinya Nakatsu , Kouji Sasaki , Takahiro Shimura , Hisashi Tanie
- Applicant: Hitachi Automotive Systems, Ltd.
- Applicant Address: JP Hitachinaka-shi
- Assignee: Hitachi Automotive Systems, Ltd.
- Current Assignee: Hitachi Automotive Systems, Ltd.
- Current Assignee Address: JP Hitachinaka-shi
- Agency: Crowell & Moring LLP
- Priority: JP2014-160942 20140807
- International Application: PCT/JP2015/068937 WO 20150701
- International Announcement: WO2016/021341 WO 20160211
- Main IPC: H02K11/33
- IPC: H02K11/33 ; H02M7/537 ; H02M7/00 ; H05K5/00 ; H05K7/20 ; B60L11/18

Abstract:
An object of the present invention is to provide a power module having high reliability. The power module according to the present invention, includes a circuit body and a case housing the circuit body. The case has a first case member including a first base plate and a second case member including a second base plate. The first case member has a first side wall portion formed in an arrangement direction of the first base plate and the second base plate. The second case member has a second side wall portion formed in the arrangement direction, the second side wall portion coupling to the first side wall portion. The first side wall portion and the second side wall portion are formed so as to have the sum of lengths of the first side wall portion and the second side wall portion in the arrangement direction smaller than the thickness of the circuit body. The first case member has a deforming portion smaller than the first base plate and the second base plate in rigidity.
Public/Granted literature
- US20170187300A1 Power Module Public/Granted day:2017-06-29
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