Invention Grant
- Patent Title: Electrostatic chuck assemblies capable of bidirectional flow of coolant and semiconductor fabricating apparatus having the same
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Application No.: US14842936Application Date: 2015-09-02
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Publication No.: US09912258B2Publication Date: 2018-03-06
- Inventor: Haejoong Park , Hongmyoung Kim , Kye Hyun Baek , Sangkyu Park
- Applicant: SAMSUNG ELECTRONICS CO., LTD.
- Applicant Address: KR Suwon-si, Gyeonggi-do
- Assignee: SAMSUNG ELECTRONICS CO., LTD.
- Current Assignee: SAMSUNG ELECTRONICS CO., LTD.
- Current Assignee Address: KR Suwon-si, Gyeonggi-do
- Agency: Lee & Morse, P.C.
- Priority: KR10-2014-0117784 20140904
- Main IPC: H01T23/00
- IPC: H01T23/00 ; H02N13/00 ; H01L21/67 ; H01L21/683

Abstract:
An electrostatic chuck assembly, including an electrostatic chuck on which a substrate is loaded; a channel that provides a flow passage for coolant in the electrostatic chuck, the channel having a first opening at a first end corresponding to a center of the substrate and a second opening at a second end corresponding to an edge of the substrate; and a valve box to control a flow direction of the coolant in the channel, the valve box including a first supply valve to control an introduction of the coolant into the first opening; a first return valve to control a drainage of the coolant from the second opening; a second supply valve to control an introduction of the coolant into the second opening; and a second return valve to control a drainage of the coolant from the first opening.
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