Invention Grant
- Patent Title: Three dimensional integrated circuits
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Application No.: US14949679Application Date: 2015-11-23
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Publication No.: US09912336B2Publication Date: 2018-03-06
- Inventor: Raminda Udaya Madurawe
- Applicant: Callahan Cellular, L.L.C.
- Applicant Address: US DE Wilmington
- Assignee: CALLAHAN CELLULAR L.L.C.
- Current Assignee: CALLAHAN CELLULAR L.L.C.
- Current Assignee Address: US DE Wilmington
- Main IPC: H01L23/02
- IPC: H01L23/02 ; H03K19/177 ; H03K19/173 ; H01L21/822 ; H01L27/06

Abstract:
A three-dimensional semiconductor device, comprising: a first module layer having a plurality of circuit blocks; and a second module layer positioned substantially above the first module layer, including a plurality of configuration circuits; and a third module layer positioned substantially above the second module layer, including a plurality of circuit blocks; wherein, the configuration circuits in the second module control a portion of the circuit blocks in the first and third module layers.
Public/Granted literature
- US20160134288A1 THREE DIMENSIONAL INTEGRATED CIRCUITS Public/Granted day:2016-05-12
Information query
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